Engineer Concept
STEP 1: We will either use your Orcad schematic supplied by your engineering staff or we will capture what you have available. As a separate service we work closely with our local engineers.
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ALL PHASES OF STATE OF THE ART HDI PCB DESIGN:
PCB Design Using The Following Methods:
Chip On Board (COB) is a method of circuit board manufacturing in which the integrated circuits are attached bonded directly to a pcb design, and covered by a blob of epoxy. Chip on board eliminates the packaging of individual semiconductor devices.
Glob-top is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly used in electronic toys and low-end devices.
Flip Chip On Board In “flip chip on board”, the device is inverted, with the top layer of metallization facing the circuit board. Small balls of solder are placed on the circuit board design traces where connections to the chip are required. The chip and board are passed through a reflow soldering process to make the electrical connections.
Wire bonding the Asic is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that PCB Design can integrated the circuit and connect it to its lead frame, but instead the chip is wire-bonded directly to the PCB Design.
Wire Bond Example
