Extensive HDI PCB Layout experience with multi-layer boards with ASICs, BGA/FPGA packages with highly constrained high-speed buses. We have familiarity with all phases of hardware development including: Orcad Schematic Capture entry, signal integrity practices, constraint entry, library creation, DFM, Experience with a broad range of PCB form factors, also experienced with HDI / Blind and Buried Vias Type4 Printed Circuit Board Design,
Printed Circuit Board Design Via Types:
TENTED VIAS: These are Type I vias where a mask material bridges over it and no additional is present inside the hole.
TENTED AND COVERED VIAS: These are Type II vias with a secondary covering of mask material covering the tented via.
PLUGGED VIAS: These are Type III vias with a material partially penetrating the hole.
PLUGGED AND COVERED VIAS: These are Type IV vias with a secondary covering of material over the type III vias.
FILLED VIAS: These are Type V vias with a material fully penetrating and encapsulating the hole.
FILLED AND COVERED VIAS: These are Type VI vias with a material covering the Type V vias.
FILLED AND CAPPED VIAS: These are Type VII vias with a metalized secondary coating covering the Type V vias.Placement and routing studies to optimize new FPGA package ball maps , Experience with Impedance Control and Transmission Line applications, Excellent problem solving skills, Ownership of the layout from feasibility studies to board tape-out, Constraint entry of signal integrity guidelines, Interface with Manufacturing Engineers, Experience in PC, Tablet and motherboard designs, Experience with Analog design layout techniques, Along with Experience with RF design layout techniques as well.
Chip On Board: (COB) is a method of circuit board manufacturing in which the integrated circuits are attached bonded directly to a Printed Circuit Board Design, and covered by a blob of epoxy. Chip on board eliminates the packaging of individual semiconductor devices.
Glob-top: is a variant of conformal coating used in chip-on-board assembly (COB). It consists of a drop of specially formulated epoxy or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation. It is most commonly used in electronic toys and low-end devices.
Flip Chip: On Board In “flip chip on board”, the device is inverted, with the top layer of metallization facing the circuit board. Small balls of solder are placed on the circuit board design traces where connections to the chip are required. The chip and board are passed through a reflow soldering process to make the electrical connections.
Wire bonding: the Asic is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that Printed Circuit Board Design can integrated the circuit and connect it to its lead frame, but instead the chip is wire-bonded directly to the PCB Design.